Horizontal kiln

Silicon oxygen horizontal drying furnace is a low-temperature and high-efficiency drying equipment designed specifically for silicon-based materials. Its core achieves uniform dehydration of heat-sensitive and easily oxidizable materials through vacuum environment, conductive heating, and mechanical stirring/vibration, avoiding the risk of high-temperature deterioration or oxidation.

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Product Highlights

Large area interlayer heating

The heating area reaches 6-19.3 m ², the heat transfer efficiency is increased by 30%, and the drying cycle is shortened.

Dynamic mixing/vibration

Rake teeth or vibration fluidization technology eliminate dead corners of materials, with a uniformity deviation of less than 5%, avoiding damage to the silicon oxide structure caused by local overheating.

Fully enclosed vacuum system

Vacuum degree reaches 0.09-0.1 MPa, inhibits oxidation reaction, solvent recovery rate>95%, reduces VOC emissions.

Dust free operation

Enclosed structure+integrated dust removal interface (such as gas sealed dome valve), residual material rate<1%, in compliance with GMP/FDA certification requirements.

Wide temperature range temperature control

The jacket supports hot water/thermal oil circulation, with a temperature control range of -20 ℃ to 300 ℃, meeting the full process requirements of silicon oxide materials from low-temperature dehydration to high-temperature carbonization.

Product Parameters

Working volume(L)	Heating area(m²)	Power(kW)	Temperature control range(℃)	Degree of vacuum(MPa)
500–1500	3.3–9.1	3.3–5.5	≤130	5.2×10⁻³

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