Grinder

The LATP grinder is a precision machining equipment designed specifically for solid electrolyte materials. Through mechanical friction, ultrasonic vibration, or chemical mechanical polishing techniques, it achieves nanoscale flatness and low damage treatment of the material surface, ensuring consistent ion conductivity.

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Product Highlights

Nano level planar control

The diamond dressing system ensures a flatness of ± 0.002mm for the grinding disc and a flatness of ± 0.0005mm for the workpiece after processing, improving the uniformity of LATP ion channels.

Intelligent frequency adaptation

The ultrasonic machine automatically detects the thickness of consumables and the surface condition of workpieces, dynamically adjusts the amplitude and frequency, and reduces human errors.

Grinding polishing integrated

Some models support the entire process from rough grinding to fine polishing, and the magnetic chassis enables quick switching between sandpaper/polishing cloth, increasing efficiency by 5 times.

Complex structure adaptation

The ultrasonic vibration head can handle 0.5mm narrow gaps, 180mm deep holes, and curved surfaces, covering the entire scene of molds and irregular workpieces.

Sealed dustproof design

Integrated cyclone dust removal+filter element recovery, residual material rate<0.1%, cleaning cycle extended to 2000 hours.

Product Parameters

Grinding disc size(mm)	Speed range(rpm)	Flatness accuracy(mm)	Main motor power(kW)	Grinding disc size(mm)
φ50–100	&50–100	≤±0.001	≤1.5	≥φ250

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